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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
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Common Anode Silicon Dual Switching Diode
This Common Anode Silicon Epitaxial Planar Dual Diode is designed for use in ultra high speed switching applications. This device is housed in the SOT-416/SC-90 package which is designed for low power surface mount applications, where board space is at a premium. * Fast trr * Low CD * Available in 8 mm Tape and Reel
DAP222
SOT-416/SC-90 PACKAGE COMMON ANODE DUAL SWITCHING DIODE SURFACE MOUNT
3 2 1
CASE 463-01, STYLE 4 SOT-416/SC-90
MAXIMUM RATINGS (TA = 25C)
Rating Reverse Voltage Peak Reverse Voltage Forward Current Peak Forward Current Peak Forward Surge Current Symbol VR VRM IF IFM IFSM(1) Value 80 80 100 300 2.0 Unit Vdc Vdc mAdc mAdc Adc 1 CATHODE 2 ANODE 3
DEVICE MARKING
DAP222 = P9
THERMAL CHARACTERISTICS
Rating Power Dissipation Junction Temperature Storage Temperature Symbol PD TJ Tstg Max 150 150 - 55 ~ + 150 Unit mW C C
ELECTRICAL CHARACTERISTICS (TA = 25C)
Characteristic Reverse Voltage Leakage Current Forward Voltage Reverse Breakdown Voltage Diode Capacitance Reverse Recovery Time 1. t = 1 S 2. trr Test Circuit on following page. Symbol IR VF VR CD trr(2) Condition VR = 70 V IF = 100 mA IR = 100 A VR = 6.0 V, f = 1.0 MHz IF = 5.0 mA, VR = 6.0 V, RL = 100 , Irr = 0.1 IR Min -- -- 80 -- -- Max 0.1 1.2 -- 3.5 4.0 Unit Adc Vdc Vdc pF ns
Thermal Clad is a trademark of the Bergquist Company REV 1
Motorola Small-Signal Transistors, FETs and Diodes Device Data (c) Motorola, Inc. 1996
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DAP222
TYPICAL ELECTRICAL CHARACTERISTICS
100 IF, FORWARD CURRENT (mA) TA = 85C 10 TA = - 40C IR , REVERSE CURRENT (A) 10 TA = 150C 1.0 TA = 125C
0.1
TA = 85C
1.0
TA = 25C
TA = 55C 0.01 TA = 25C
0.1 0.2 0.4 0.6 0.8 1.0 VF, FORWARD VOLTAGE (VOLTS) 1.2
0.001 0 10 20 30 40 VR, REVERSE VOLTAGE (VOLTS) 50
Figure 1. Forward Voltage
Figure 2. Reverse Current
1.75 CD , DIODE CAPACITANCE (pF)
1.5
1.25
1.0
0.75
0
2
4
6
8
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Diode Capacitance
RECOVERY TIME EQUIVALENT TEST CIRCUIT
INPUT PULSE
tr tp
OUTPUT PULSE
trr IF t t
A
RL
10% Irr = 0.1 IR 90% VR tp = 2 s tr = 0.35 ns IF = 5.0 mA VR = 6 V RL = 100
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Motorola Small-Signal Transistors, FETs and Diodes Device Data
DAP222
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
TYPICAL SOLDERING PATTERN Unit: mm 0.5 min. (3x)
SOT-416/SC-90 POWER DISSIPATION
The power dissipation of the SOT-416/SC-90 is a function of the pad size. This can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet, PD can be calculated as follows. PD = TJ(max) - TA RJA the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device which in this case is 125 milliwatts. PD = 150C - 25C 833C/W = 150 milliwatts
The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C.
Motorola Small-Signal Transistors, FETs and Diodes Device Data
EEE EEE EEE EEE EEE EEE EEE EEE EEE
0.5 min. (3x) 1.4
0.5 1
The 833C/W assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 150 milliwatts. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as Thermal Clad, a higher power dissipation can be achieved using the same footprint.
* The soldering temperature and time should not exceed * When shifting from preheating to soldering, the * After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. maximum temperature gradient should be 5C or less. 260C for more than 10 seconds.
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DAP222
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or stainless steel with a typical thickness of 0.008 inches. The stencil opening size for the surface mounted package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating "profile" for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 4 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177 -189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints.
STEP 1 PREHEAT ZONE 1 "RAMP" 200C
STEP 2 STEP 3 VENT HEATING "SOAK" ZONES 2 & 5 "RAMP"
STEP 5 STEP 4 HEATING HEATING ZONES 3 & 6 ZONES 4 & 7 "SPIKE" "SOAK" 170C 160C
STEP 6 STEP 7 VENT COOLING 205 TO 219C PEAK AT SOLDER JOINT
DESIRED CURVE FOR HIGH MASS ASSEMBLIES 150C
150C 140C SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY)
100C 100C
DESIRED CURVE FOR LOW MASS ASSEMBLIES 50C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 4. Typical Solder Heating Profile
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Motorola Small-Signal Transistors, FETs and Diodes Device Data
DAP222
PACKAGE DIMENSIONS
-A- S
2 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. DIM A B C D G H J K L S MILLIMETERS MIN MAX 0.70 0.80 1.40 1.80 0.60 0.90 0.15 0.30 1.00 BSC --- 0.10 0.10 0.25 1.45 1.75 0.10 0.20 0.50 BSC INCHES MIN MAX 0.028 0.031 0.055 0.071 0.024 0.035 0.006 0.012 0.039 BSC --- 0.004 0.004 0.010 0.057 0.069 0.004 0.008 0.020 BSC
G -B-
1
D 3 PL 0.20 (0.008)
M
B K
0.20 (0.008) A
J
C L H
STYLE 4: PIN 1. CATHODE 2. CATHODE 3. ANODE
CASE 463-01 ISSUE A SOT-416/SC-90
Motorola Small-Signal Transistors, FETs and Diodes Device Data
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DAP222
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DAP222/D Motorola Small-Signal Transistors, FETs and Diodes Device Data

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